Xiaomi to debut the new Dimensity 9000+ flagship processor

Popular Weibo tech blogger, @DCS reveals that Xiaomi will unveil a new smartphone with the Dimensity 9000+ flagship processor. Recall that the Dimensity 9000+ flagship processor is the theoretically best-performing chip in the industry. Its running scores beat that of the Snapdragon 8+ Gen 1. According to previous reports, the Xiaomi 12S Pro will have a Snapdragon version as well as a Dimensity version. The processor on the Dimensity version may be the Dimensity 9000+. This is also the first time that Xiaomi has used MediaTek 5G chips on the flagship of the digital series.

Recall that MediaTek only launched the Dimensity 9000+ this week. It is used to benchmark Qualcomm Snapdragon 8+, and its performance is slightly better relative to the Dimensity 9000. Specifically, the Dimensity 9000+ increases the frequency of a single super-core X2 from 3.05GHz to 3.2GHz. However, the three large-core A710s maintain their 2.85GHz frequency. Also, the four small-core A510s maintain their 1.8GHz frequency. Officially, the performance 5% better. Furthermore, the GPU is Mali-G710 and the company claims that the performance increases by 10%.

In terms of running points, the Dimensity 9000+ has a single-core score of 1322 as well as a multi-core score of 4331. It also surpasses the Qualcomm Snapdragon 8+ Gen 1. The device with this chip will launch in Q3 this year.

Dimensity 9000+ is basically the same as those of the Dimensity 9000. The improvements are as follows

• Dimensity 9000+ (using ARM's v9 CPU architecture and 4nm octa-core process). CPU performance increases by 5% while GPU performance is increased by 10%
• The frequency of Cortex-X2 large core increases from 3.05GHz in Dimensity 9000 to 3.2GHz

In addition, Dimensity 9000+ supports LPDDR5X memory. It also comes with MediaTek's fifth-generation Al processor APU and built-in M80 5G baseband.

Dimensity 9000+ details

Here is what MediaTek has to say regarding the Dimensity 9000+ SoC

Even More Speed. Same Incredible Power Efficiency

Our flagship chip is now even faster. The higher clocked Arm Cortex-X2 CPU and Arm Mali-G710 MC10 graphics engine raise performance even further!

• Our fastest ever Arm Mali-G710 MC10 graphics engine
• Ultra-Core-1x Arm Cortex-X2 at 3.2GHz
• Super-Cares-3x Arm Cortex-A710 up to 2.85GHz
• Efficiency Cores-4x Arm Cortex-A510
• LPDDR5X up to 7500Mbps - 20% more power efficient than LPDDR5
• Industry-leading TSMC N4 (4nm-class) chip production process

MediaTek Imagiq 790

The flagship 18-bit HDR-ISP can record HDR video on three cameras simultaneously, ensuring you never miss anything!

• Incredibly powerful 9Gpixel/s ISP
• Simultaneous triple camera HDR video recording
• 320MP camera support for smartphones
• Record 4K HDR video with powerful Al-noise reduction
• Exceptionally fast Al-noise reduction for photo capture

MediaTek APU 590

5th Generation Al engine achieves maximum effective performance in Al-multimedia,-gaming. -camera, as well as social video experiences

• Up to 4X power efficiency upgrade vs last generation
• End-to-end upgrade maximizes efficiency

MediaTek MiraVision 790

The latest HDR support, the fastest displays with Intelligent technologies that ensure excellent power - efficiency. It is also the best visual enhancements in every app, media stream and game

• New HDR10 + Adaptive video support
• 144Hz WQHD + or 180Hz Full HD + displays
• MediaTek intelligent Display Sync 20
• Wi-Fi Display up to 4K60 HDR10+

MediaTek HyperEngine 5.0

Exclusive gaming technologies that ensure longer lasting. amped visuals with smoother gameplay

• Al-enhanced variable-rate shading technology (Al-VRS)
• Raytracing development tools available for game developers
• Hybrid Al-GPU Super-Resolution for gaming for Android
• MediaTek WI-FI Fast Path for Lower latency connections
• Wi-Fi/Bluetooth Hybrid Coexistence 2.0

Leading 3GPP Release-16 5G Smartphone Modem

Extremely powerful sub-6GHz performance with latest 3GPP Release-16 standard technology 5G modem that's built directly into the chip

• Latest 3CC Carrier Aggregation (300MHz) support
• Up to 7Gbps super-fast downlink
• MediaTek SG UltraSave 2.0 power-saving enhancement suite
• R16 UL Tx Switching for both SUL and NR UL-CA based connections
• New Dual SIM Dual 4G / 5G Active (DR -DSDA)

Latest Connectivity & Wireless Audio

Empowered connectivity with the very latest Wi-Fi, Bluetooth as well as GNSS technologies

• WH6E2x2 (BW160) with the latest tri-band 2.4GHz, 5GHz as well as 5GHZ support
• Bluetooth 5.3 with Bluetooth LE Audio-ready technology
• Dual-Link True Wireless Stereo Audio
• Beidou 1-BIC GNSS support